Three Industry Standards Officially Implemented | Xiamen Hatro Electronics Defines New Benchmark for Domestic Semiconductor Packaging & Testing Materials through Full-Chain Technical Capabilities

• 2026-09-17

DESCRIPTIONOn September 1, 2026, three electronic industry standards led by Xiamen Hatro Electronics Co., Ltd. as the first drafting organization were officially implemented by the Ministry of Industry and Information Technology. These standards cover cover tape, carrier tape, and tape reels for surface mount technology (SMT), marking a milestone in China's semiconductor packaging & testing materials industry.

KEYWORDSCarrier Tape, Cover Tape, Tape Reels, SMT Packaging Materials, Semiconductor Packaging & Testing, Electronic Industry Standard, SJ/T 12179, SJ/T 12180, SJ/T 12181, Xiamen Hatro Electronics, Die Carrier Tape, Conductive Masterbatch, Full-Chain Closed-Loop

Brief DescriptionThis article introduces the three newly implemented electronic industry standards (SJ/T 12179-2026, SJ/T 12180-2026, SJ/T 12181-2026) for SMT packaging materials, drafted primarily by Xiamen Hatro Electronics as the first drafting organization. It highlights Hatro's unique full-chain closed-loop ecosystem—from raw material formulation and precision mold design to dedicated equipment and finished carrier tape products—and its role in advancing domestic semiconductor packaging & testing material independence.

Three Industry Standards Officially Implemented | Xiamen Hatro Electronics Defines New Benchmark for Domestic Semiconductor Packaging & Testing Materials through Full-Chain Technical Capabilities

On September 1, 2026, three electronic industry standards officially entered into implementation. Issued by the Ministry of Industry and Information Technology (MIIT) and managed by the National Technical Committee on Semiconductor Equipment and Materials of Standardization Administration of China (SAC/TC203), the standards are: SJ/T 12179-2026 Electronic Packaging Material — Cover Tape for Surface Mount Technology (SMT), SJ/T 12180-2026 Electronic Packaging Material — Carrier Tape for Surface Mount Technology (SMT), and SJ/T 12181-2026 Electronic Packaging Material — Tape Reels for Surface Mount Technology (SMT). Xiamen Hatro Electronics Co., Ltd. (hereinafter "Hatro Electronics") served as the first drafting organization (lead drafter / initiator) for all three standards, translating over two decades of technical accumulation into public industry specifications and marking China's transition from manufacturing to standard-setting in the SMT packaging materials sector.

Three Standards: A Complete Technical Specification System for Carrier Tape — Cover Tape — Tape Reels

The three standards cover the core product chain of SMT packaging materials, systematically specifying the full lifecycle requirements including product classification and nomenclature, technical requirements, test methods, inspection rules, labeling, packaging, transportation, storage, and traceability management. They fill a gap in China's domestic standard system in this field. Specifically, the carrier tape standard defines critical parameters such as dimensional accuracy, electrical conductivity, appearance quality, and thermal/humidity resistance; the cover tape standard specifies core parameters including peel strength, heat-sealing performance, and aging resistance; and the tape reel standard sets requirements for structural dimensions, concentricity, and dynamic balance accuracy.

The unified implementation of these three standards provides a consistent quality benchmark and technical language for the domestic carrier tape industry chain, with practical significance for regulating industry competition, improving product consistency, and ensuring downstream packaging reliability.

Full-Chain Closed-Loop: The Technical Foundation Behind Hatro's Leadership in Standard Setting

Hatro Electronics' ability to lead the drafting of these three industry standards stems from its unique technical capabilities in the semiconductor packaging & testing materials field. The company is currently the only enterprise globally that has achieved a fully self-controlled "raw material formulation — precision mold — dedicated equipment — finished carrier tape product" closed-loop industry chain.

• Raw Material Formulation: Hatro independently develops the HDL-PS series conductive masterbatch, with carbon black content ≥42%, volume resistivity ≤10² Ω·cm, filter pressure value (FPV) ≤1.5 MPa (14μm filter), dispersion quality reaching ISO 18553 Class 1, and inter-batch resistance CV value ≤5%. This ensures batch-to-batch stability of carrier tape conductive performance from the source.

• Precision Mold: The company has mastered five-axis six-face precision machining technology and equipment capabilities, with in-house carrier tape forming mold design and manufacturing expertise, controlling pocket dimensional accuracy and forming consistency at the mold level.

• Dedicated Equipment: Hatro independently develops carrier tape forming and inspection equipment, enabling online monitoring and full-process traceability during production.

• Finished Carrier Tape: Products cover PC, PS, ABS and other substrate materials, comply with EIA-481 standards and customer-specific custom specifications, and serve leading packaging & testing enterprises including JCET (Jiangsu Changjiang Electronics Technology) and Nexperia.

Industry-Academia-Research Collaboration: An Open Standard Development Mechanism

The drafting units for the three standards extend beyond the Hatro system. The three Hatro-affiliated entities—Xiamen Hatro Electronics Co., Ltd., Chengdu Hatro Optoelectronic Technology Co., Ltd., and Anhui Hatro New Material Co., Ltd.—jointly participated, together with the Xiamen Institute of Standardization, JCET (Suqian) Co., Ltd., Nexperia (China) Co., Ltd., Xiamen University, Beijing Normal University, Jiangsu Changshengwei New Material Co., Ltd., Jiejun Electronics Technology (Dongguan) Co., Ltd., Dongguan Decheng Plastic Technology Co., Ltd., and Dongguan Zhenchen Industrial Co., Ltd. This reflects an open mechanism of industry-academia-research-application collaborative standard development.

Among the main drafters, several Hatro technical personnel—including Zhou Haiming, Guan Lishan, Zheng Yao, and Zhou Haiqing—participated deeply in the research, demonstration, and drafting of standard clauses.

From Technical Accumulation to Standard Leadership

As a NEEQ-listed enterprise (Stock Code: 834954), a Fujian Provincial Specialized and Sophisticated SME, and a National High-Tech Enterprise, Hatro Electronics has focused on the semiconductor packaging & testing materials field for over two decades. The implementation of these three industry standards represents an important milestone in translating the company's decades of technical accumulation into public industry technical specifications.

Hatro Electronics states that it will take the implementation of these three standards as a new starting point, continue to leverage its full-chain technical advantages and standard leadership role, and promote domestic SMT packaging materials toward higher precision and greater reliability—contributing Hatro's strength to the independent controllability and high-quality development of China's semiconductor packaging & testing industry chain.